| 摘要 |
PURPOSE:To improve the accuracy of the temperature of treatment, and to reduce an effect on other peripheral processes of the heat of a heating plate by surrounding the periphery of the heating plate, to which a body coated with a resist is fitted, by a heat-insulating material layer and surrounding the periphery of the heat-insulating material layer by a box body with a suction port and an exhaust port connected to an exhaust means. CONSTITUTION:A resist is applied onto the surfaces of semiconductor wafers 1 by a resist coster 3 in a pre-process, and the semiconductor wafers 1 are carried and placed onto a discoid heating plate 2. The periphery of the heating plate 2 is covered with heat-insulating material layers 5 composed of a low dusting characteristic material, and the peripheries of these heat-insulating material layers 5 are surrounded respectively by a box body 10 with suctions ports 11 and an exhaust port 12 connected to an exhaust means. Consequently, transportation to the peripheries of peripheral equipments and the heating plates 2 disposed to a lower section of the heat of the heating plate 2 arranged to an upper section can be prevented. Accordingly, the accuracy of the temperature of treatment is made better than conventional devices while on effect on peripheral equipments by the heat of the heating plate can be reduced largely. |
