METHOD AND APPARATUS FOR BONDING OUTER LEAD,申请号JP19880070010-传众专利搜索

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发明名称	METHOD AND APPARATUS FOR BONDING OUTER LEAD
摘要
申请公布号	JPH01241890(A)	申请公布日期	1989.09.26
申请号	JP19880070010	申请日期	1988.03.24
申请人	MATSUSHITA ELECTRIC IND CO LTD	发明人	ANDO TAKEO;MAKINO YUTAKA;KABESHITA AKIRA
分类号	H05K3/32	主分类号	H05K3/32
代理机构		代理人
主权项
地址

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