| 摘要 |
PURPOSE:To make it possible to form specified circuits by an electroless plating method on an electric insulating layer without decreasing insulation reliability between the circuits, by forming a separable resist layer beforehand at a part where a circuit is not formed on the surface of the electric insulating layer, and separating the separable resist layer after the activation of a catalyst. CONSTITUTION:After a catalyst on the surface of an electric insulating layer 1 is activated, electroless plating is performed. Thus a circuit is formed. When a printed wiring board is manufactured in this way, a separable resist layer 5 is formed beforehand on a part where a circuit is not formed on the surface of the electric insulating layer 1. After the catalyst is activated, the separable resist layer 5 is separated, and a catalyst active layer 2 is formed selectively only at a part where the circuit is formed. Thereafter, electroless plating is performed, and a specified circuit 3 is obtained. As the said separable resist layer 5, a material having the following property can be used: the material that is resistant to aqueous solution of hydrochloric acid of palladium chloride; the material that does not hinder the activation of the catalyst at the circuit forming part; and the material that can be separated after the activation of the catalyst. As the separating method, it is desirable that the separation can be simply performed manually since the separation can be ensured. |
