| 摘要 |
PURPOSE:To prevent a semiconductor device from electrostatic destruction at the packaging process by a method wherein an element accommodating part to accommodate a semiconductor element, and a lead pin holding part to hold lead pins are separately manufactured previously, and connection of both is performed at the final process. CONSTITUTION:A through hole part provided to the back of a semiconductor integrated circuit accommodating part 10 is formed as to be female contacts 11, while projecting terminals 12 projecting from the insertion and extraction side of a lead wire lead-out part 9 are made to act as male contacts 12. The lead pins 7 of the lead wire lead-out part 9 are fixed to the through holes 14 of a printed wiring substrate according to the soldering method, etc. By separating the lead pin part B from the package part A in such a way, electrostatic destruction to be generated at the packaging process can be removed. |
