| 摘要 |
PURPOSE:To reduce an irregularity in a plated thin wire and to reduce an input inductance by a method wherein a semiconductor element is inserted into a hole made in a substrate and a circuit pattern and a pad part are fixed on an identical plane and connected by using the plated thin wire. CONSTITUTION:Pad parts 9 formed on a semiconductor element 3 and circuit patterns formed on a dielectric substrate 1 are fixed in such a way that they are situated on an almost identical plane; they are connected to be conductive by using plated thin wires 10. By this constitution, an irregularity in the plated thin wires 10 can be reduced; an inductance of an input can be reduced. In addition, the area of the plated pads 9 can be made small; a parasitic capacitance can be reduced. |
