发明名称 SOLDERING PROCESS
摘要 PURPOSE:To automate supply of a solder material for simplifying assembly work without disturbing the penetration of an earth load on account of the solder material, by temporarily fixing the solder material on the earth lead having a swollen portion on its one part. CONSTITUTION:A granulated or rod-shaped solder material 14 is temporarily fixed to the lower part of a swollen portion 13a of an earth lead 13 by using in advance an assembly jig or the like in order to form a compound body 12 consisting of the earth lead-solder material. By using a carbon-made soldering jig, the earth lead-solder material compound body 12 is inserted through a throughhole 11 of a stem substrate 10. The temporarily fixed solder material 14 is housed in a tapered recessed part 11 a causing no obstruction. When the whole is heated up to the melting temperature of the solder material 14, the solder material is guided to the tapered recessed part 11a to flow into the throughhole 11 so that the earth lead 13 is soldered to the stem substrate 10. The troublesome supply of the solder material can be automated as to remarkably facilitate assembly work without causing any obstacle to penetration of the earth lead by the solder material.
申请公布号 JPH01239787(A) 申请公布日期 1989.09.25
申请号 JP19880065194 申请日期 1988.03.17
申请人 NEC KANSAI LTD 发明人 OI KENTARO;OKUNO AKIRA
分类号 H01R9/16;H01L23/12;H01L23/48;H01R43/20 主分类号 H01R9/16
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