| 摘要 |
<p>PURPOSE:To transfer specific blade groups and blade moving plate groups at different pitches in a short time, to facilitate the operation and to obtain a device capable of easily coping with complete automation by providing the specific blade groups, blade moving plate groups, a moving plate telescoping mechanism and a moving stroke regulating mechanism. CONSTITUTION:Wafer holders 19-26 for holding semiconductor wafers 18, blade groups 10-17 arranged in parallel with each other, blade moving plate groups 2-8 mounted perpendicularly corresponding to the blade of the groups 10-17 and arranged in parallel with each other, moving plate telescoping mechanisms 23, 24 for telescoping the groups 2-8 in the arranging direction of the blades 10-17, and a moving stroke regulating mechanism 31 for limiting the moving distance of the plates 2-8 telescoped by the mechanisms 33, 34 with respect to at least one directional operation independently at the plates 2-8 are provided. The intervals of the blades 10-17 are regulated by the telescoped amounts of the plates 2-8 to alter the arranging pitches of the wafers 18.</p> |
