| 摘要 |
PURPOSE:To obtain an excellent transmission characteristic by providing a ground pattern connected to a rear face conductor face through a through hole, etc., to the front face of the dielectric board and connecting the ground pattern to the rear face ground conductor face of other dielectric board or the ground pattern formed similarly. CONSTITUTION:Strip patterns 3A, 3B formed to dielectric boards 1A, 1B are connected to a connection conductor 4 by solder 5. Moreover, the same grounding is arranged, the ground patterns 7A, 7B are provided on the front face of the dielectric boards 1A, 1B and they are soldered to attain common grounding. Furthermore, the ground patterns 7A, 7B are connected to the rear face ground conductors 2A, 2B by through holes 8A, 8B. Then the ground patterns 7A, 7B are made lose to the strip patterns 3A, 3B up to a range not giving any high frequency effect. Thus, the same ground is implemented in terms of high frequency, then electric field distribution is continuous and an excellent transmission characteristic is obtained. |
