| 摘要 |
PURPOSE:To accurately align without controlling shrinkage at the time of baking at a short manufacturing lead time and to obtain a high thermal conductivity multilayer ceramic wiring substrate to be formed with a high density circuit by multilayering with a conductor containing as a main ingredient silver and an insulator containing as a main ingredient aluminum nitride powder on a sintered aluminum nitride. CONSTITUTION:Paste for a conductor containing as a main ingredient silver is printed in a predetermined pattern by a screen printing method on a sintered aluminum nitride substrate 1. Then, it is left to stand for at room temperature, further dried by infrared ray or in an electric furnace to form a lower layer conductor 2a. Thereafter, insulating paste mixed with organic vehicle to which glass powder is added to aluminum nitride powder is printed by a screen printing method on a part crossovered with the conductor 2a. Subsequently, the paste is left to stand for similarly to the conductor paste, dried to form an insulator 3, and an upper layer conductor 2b is formed thereon. Thus, alignment is accurately performed, and a substrate to be formed in a high density circuit can be obtained. |
