| 摘要 |
PURPOSE:To narrow a sealing region without exposing the peripheral edge of a semiconductor chip and to obtain a semiconductor device having a small size and preferably sealed with resin by covering the peripheral edge of the chip with a resin having high viscosity, and covering the surface of the chip surrounded by resin having low viscosity with resin having low viscosity. CONSTITUTION:Liquid resin of polyimide resin having low viscosity is potted from a nozzle on a semiconductor chip 3 as a second resin sealing part 6, cured at approx. 100-170 deg.C, the liquid resin of polyimide resin having high viscosity is potted to cover to a bonding wiring 4 to the peripheral edge of the chip 3 as a first resin sealing part 5, and the parts 5, 6 are cured at approx. 100-170 deg.C. In this case, when only the part 6 is cured, the part 6 is so cured as to be an intermediate state not completely cured. Thus, a thin and small-sized preferable resin sealing part is obtained. |
