ELECTRON BEAM CURABLE COMPOSITION

摘要

{PG,1 A cured adhesive composition possessing excellent cohesive strength at high temperatures along with excellent shear strength and solvent resistance is prepared by the electron beam initiated curing of an adhesive composition comprising selectively hydrogenated monoalkenyl arene/conjugated diene block copolymer component, tackifying resin and a di-to-tetra-functional acrylate or methacrylate selected from the group consisting of acrylic and methacrylic acid esters of polyols.