| 摘要 |
PURPOSE:To prevent generation of structural defects such as cracks by containing an organic binder and a solvent with respect to a mixture having 10-70wt.% of Cu. CONSTITUTION:In a mixture composed of 0.1-10mum of CuO and Cu in average particle dia. as a starting raw material, 0.5-10wt.% of an organic binder and a solvent are added with respect to a mixture composed of CuO and Cu, or CuO and additive inorganic gradients, by the use of a mixture having 10-70wt.% of Cu. Since it is possible to remove the organic binder completely without generation of problems such as cracks under an oxide atmosphere, and to pre vent carbon from remaining, it is thus possible to prevent the insulation resis tance and baking density from lowering due to reduction of ceramic material at the time of baking. |
