ASSEMBLY PROCESS FOR PRODUCING LED ROWS

摘要

A process for assembling strip-like LED chips (112) in a row on a solid metal support (M) permits compliance with extremely close tolerances in all three directions as regards interspacing, linearity and surface planarity. In addition, optimal thermal coupling to the metal support (M) ensures dissipation of the high heat loses from the LEDs (113) of an LED chip (112). The LED chips (112) are placed on the metal support (M) by a transfer process. They are accurately positioned, face upward, and glued onto an auxiliary support (H1). The prefabricated LED row (114) is then soldered to the previously soldered metal support (M), after which the auxiliary support (H1) is detached.