| 摘要 |
<p>The method and apparatus for removing defective solder according to the present invention are characterized by pressing a suction wire onto the defective solder on a printed board, heat melting the defective solder while supplying a small quantity of molten solder to the suction wire, and removing the melted defective solder by sucking utilizing a capillary action of the suction wire. Therefore, even when a soldering operation fails with defective solder remaining on a printed board, the defective solder can be removed simply without fail. This enables the re-soldering to be done easily and the overall efficiency of a soldering operation to be improved. When the apparatus is provided with the soldering function in addition to the defective solder removing function, a correct soldering operation can be carried out immediately after the defective solder has been removed. Since the defective solder is removed by utilizing the capillarity of the suction wire, i.e., a physical phenomenon, troubles rarely occur involving the defective solder removing operation, and the maintenance work for the apparatus can be advantageously carried out.</p> |
