发明名称 INTERCONNECTION MECHANISMS FOR ELECTRONIC COMPONENTS
摘要 <p>An electronic circuit component housing assembly (12) adapted to be mounted mechanically on a printed circuit (10), using a single mechanical fastener (49) to attach the circuit component housing assembly (12) in a unique alignment with the printed circuit (10), and simultaneously using the fastener (49) to provide force to press physically compliant electrical contacts (56) included in the circuit component housing assembly into electrical contact with terminal contact pads (70) on the printed circuit (10). Several electronic circuit components (1210, 1302, 1338) may be housed in separate hermetically sealed cavities (1208, 1300, 1336) and can be biased independently of one another. Thermal conductors (1188) are included in the base member (600, 1206) and a convection cooler (644, 1192) is mounted atop the assembly. The mechanical fastener (1230) also acts as a thermal conductor. A test probe assembly (130) including multiple contacts may be mounted on the electronic circuit component housing (12).</p>
申请公布号 WO8908975(A1) 申请公布日期 1989.09.21
申请号 WO1989US01093 申请日期 1989.03.17
申请人 POLONIO, JOHN, D. 发明人 POLONIO, JOHN, D.
分类号 H05K3/32;H05K7/10;(IPC1-7):H05K1/18 主分类号 H05K3/32
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