| 摘要 |
<p>PURPOSE:To enhance the anti-rupture strength of an IC chip against the bending of an IC card to a great extent, by a method wherein a micro-crack layer caused by a mechanical abrasion on the reverse side of the IC chip is removed by etching. CONSTITUTION:An IC chip is formed by providing electrodes 2, a diffusion layer 3, and the like on the surface of an IC chip 1 in a wafer processing. On the reverse surface of the IC chip 1, a removal layer 4 consisting of a mechanical abrasion layer 5 to be ground with a #4000 or #8000mesh and a chemical abrasion layer 6 to be removed by chemical etching is formed. Here, a micro-crack layer 6' is a flow caused by a mechanical abrasion and assumed to have a 5mum thickness more or less, therefore being completely included in the chemical abrasion layer 6 having a thickness of the order of 10mum, which is removed by chemical etching. In this manner, the micro-crack layer 6' is perfectly removed. Then, the anti-rupture strength of the IC chip is approximately three times that of a chemical etching-free IC chip, thereby remarkably improving an IC chip anti-rupture strength.</p> |
