| 摘要 |
PURPOSE:To laminate a metallic foil without forming irregularities, and to prevent the generation of trouble in the formation of a circuit by laminating the metallic foil onto the surface of a primary laminate, in which a plurality of metallic plates provided with through-holes are laminated through prepregs and cured, through the prepregs and preparing a secondary laminate. CONSTITUTION:Several metallic plates 2, 2... to which through-holes 1 are formed are superposed through prepregs 3a, 3a... while prepregs 3a are stacked onto the outside surfaces of metallic plates as outermost layers. The stack is heated and pressure-molded, a resin impregnated to the prepregs 3a is cured, and each metallic plate is laminated and bonded while one parts of the resin infiltrated in the prepregs are made to flow and filled into respective through-hole in the metallic plates. Metallic foils 6 are superposed onto the surface of a primary laminate 7 through prepregs 3b, and heated and pressure-molded, the resin infiltrated in the prepregs is cured, and the metallic foils 6 are laminated and bonded to the surfaces of the primary laminate, thus preparing a secondary laminate 8. Even when indentations are shaped to the surfaces of the primary laminate by the inflow of the resin to the through-holes in the metallic plates, the indentations are buried with the resin in the prepregs, on which the metallic foils are laminated on postforming, thus preventing the formation of irregularities in the metallic foils on the secondary laminate. |
