| 摘要 |
<p>PURPOSE:To eliminate a bending process of a lead part and to electrically insulate the side of the direction where the lead part is extended during a sur face mounting operation by a method wherein an external electrode is installed on a face identical to a heat sink. CONSTITUTION:A heat sink 1 where a semiconductor chip 4 has been mounted and an external electrode 3 are installed on an identical face on the surface which is used also as an electrode whose rear is exposed. In order to realize this shape, a lead part inside the semiconductor chip of the external electrode 3 is fixed to a face identical to the heat sink 1 by using a tie bar 6 made of a resin; after the lead part has been bent nearly perpendicularly to a direction B perpendicular to a direction A from a tab to an island, it is extended. The lead part inside the semiconductor chip of the external electrode 3 is extended in the direction A from the tab to the inside; when a part at a tip part from the tie bar 6 is cut, a side face 9 of a sealing resin 2 in the direction where the lead part inside the semiconductor chip is extended is insulated electrically.</p> |
