发明名称 RESIN ENCAPSULATION MOLD FOR ELECTRONIC PART
摘要 PURPOSE:To contrive to improve the releasability and, to shorten the curing time and consequently to shorten molding cycle time by a method wherein surfaces, with which molten resin material comes into contact, in the parting line(P.L) faces of molds are made of nickel or nickel alloy. CONSTITUTION:On surfaces, with which molten resin material comes into contact, in the P.L faces of a fixed top force 11 and of a movable bottom force 12, or on passages 17 for transferring molten resin material, which consists of the cull 171 of the top force corresponding to a pot 15 for feeding resin material 14 and a gate 172 communicating the cull and an upper cavity 111, upper and lower cavities 111 and 121 and air vents 112, which communicate the upper cavities 111 with outside, an electroless nickel deposit, for example, is applied in order to form a super-hard electroless nickel deposit A by heat- treating. In addition, a numeral 16 represents a plunger for pressurizing resin material filled in the port 15 and a numeral 18 represents a heater for heating the forces.
申请公布号 JPH01235620(A) 申请公布日期 1989.09.20
申请号 JP19880064194 申请日期 1988.03.16
申请人 T & K INTERNATL KENKYUSHO:KK 发明人 OSADA MICHIO
分类号 B29C33/38;B29C45/02;B29C45/14;B29C45/26;B29C45/37;B29K101/10;B29K105/20;B29L31/34 主分类号 B29C33/38
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