| 摘要 |
PURPOSE:To realize a homogeneous and strong bonding operation by a method wherein a metal thin wire is pressed on a substratum of a metal member and a pressed part is heated locally before ultrasonic waves are applied to the pressed part in order to prevent an oxide from depositing at a bonding interface. CONSTITUTION:A heat-radiating sheet 1 is shifted to a bonding position; a semiconductor pellet 2 is heated to a temperature suitable for a bonding opera tion. A metal thin wire 7 is connected directly to a substratum of a load 3a with the metal thin wire pressed on the lead 3a. Infrared rays are guided to the rear of the lead 3a by using a shutter 12 and heat a pressed part locally. After this heating, the surface of the lead 3a is oxidized; an oxide film 13 is formed in the neighborhood of the pressed part. Ultrasonic waves are applied to a capillary 6 simultaneously with a start of a heating operation; the metal thin wire 7 is bonded as it keeps a contact with the substratum of the lead 3a. |
