| 摘要 |
PURPOSE:To improve the adhesion of the plating of a through-hole by a method wherein a mixture in which the granules of Al2O3.3H2O are compounded with a resin for prepreg impregnation is used, the through-hole is boring-worked, the inside of the hole is chemically treated, and a plating layer is formed onto the inner circumference of the hole. CONSTITUTION:A plurality of metallic plates 2, at through-hole forming positions of which through-holes 1 are shaped, are superposed through prepregs 3 prepared by being impregnated with a resin with which the granules of Al2O3.3H2O are blended. The superposed material is heated and pressure-molded, the resin impregnated to the prepregs is cured, and each metallic plate is laminated and bonded while the resin impregnated to the prepregs is made to flow and filled into respective through- hole in the metallic plates and cured. Through-holes 5 are boring-worked in the sections of the resins 4 in the through-holes, the insides of the through-holes are treated with an acid or alkali, and plating layers 6 are shaped onto the inner circumferences of the through-holes. Since the inner circumferences of the through-holes are treated with the acid and alkali in said process, the granules of Al2O3.3H2O exposed from the inner circumferential surfaces are melted and deep irregularities are formed, thus improving the adhesion of the through-hole plating layers. |
