| 摘要 |
PURPOSE:To increase the mounting density per package by a method wherein one or more semiconductor chips are piled up on a semiconductor chip and these are pellet-bonded by using a nonconducting adhesive. CONSTITUTION:A lower-part semiconductor chip 1B is pellet-bonded to a tab 2 by using an adhesive 3 for pellet bonding use. An upper-part semiconductor chip 1A is pellet-bonded to the lower-part semiconductor chip 1B by using a nonconducting adhesive 4 for pellet bonding use. The upper-part and lower- part semiconductor chips 1A and 1B are connected individually to lead frames 6 by using bonding wires 5A, 5B, and sealed by using a resin 7 for mold sealing use such as a resin or the like. Individual pads on the upper-part and lower-part semiconductor chips 1A and 1B and the bonding wires 5A, 5B are connected by a wedge ball bonding method. The lead frames 6 and the bonding wires 5A, 5B are connected by a thermal pressure bonding method used together with an ultrasonic oscillation. By this setup, the mounting density per package can be increased by a portion where a semiconductor chip is piled up at the upper-part.
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