| 摘要 |
PURPOSE: To achieve thinning and miniaturization through the direct connection of a chip to a packaging board by forming a head from a plating layer formed integrally with the outer peripheral surface of the end of a leg and a solder layer formed integrally with the end face of the leg and with the end face of the plating layer. CONSTITUTION: In a micro input/output pin comprising a conductive leg 2 and a conductive head 3 located at each end of the leg and being greater in diameter than the leg, the leg 2 is formed to be substantially uniform in diameter throughout its length, and each of the heads 3 comprises a plating layer 4 formed integrally with the outer peripheral surface of the leg 2 and a solder layer 5 formed integrally with the end face of the leg and with the end face of the plating layer 4. Thereby direct and fine soldering of a chip element to a packaging board in a monosilic IC or hybrid IC is made possible, and thinning, miniaturization, and cost reduction of an integrated circuit of this kind can be achieved. |
