| 摘要 |
<p>PURPOSE:To prevent the performance of a module from being deteriorated and to improve an external view by installing a protrusion-shaped terminal in a position which covers a through hole of a terminal for external extraction use. CONSTITUTION:A cavity part 12 used to house a semiconductor chip 13, a resin dam 11 and two or more wiring layers 10 are formed on the top surface of an insulating substrate 1. In addition, terminals 3 for external extraction use corresponding to the wiring layers 10 are formed on the rear surface of the insulating substrate 1. The terminals 3 for external extraction use are connected electrically to the corresponding wiring layers 10 via through holes 2; protrusion-shaped terminals 5 are installed on the terminals 3 for external extraction use in such a way that they cover through-hole lands 9 on the surface of the terminals 3 for external extraction use of the through holes 2. The surface of the protrusion-shaped terminals 5 is metal-plated 6; the terminals are fixed to the terminals 3 for external extraction use by using a conductive adhesive 4 such as an Ag paste.</p> |
