发明名称 RESIN-SEALING DEVICE FOR SEMICONDUCTOR
摘要 PURPOSE:To enhance the production efficiency and the quality of a product by installing an air vent structure at a gate part connecting an interconnection passage and a cavity. CONSTITUTION:A runner 3 is installed at two or more pots used to press and supply a resin. A first gate 4 is installed at the tip of the runner 3; a first cavity 5 is arranged at this gate 4. A second gate 6 is installed at the downstream side of the cavity 5; a second cavity 7 is connected to this gate; a third cavity 9 is connected via a third gate 8. Air vents 10 are connected to interconnection flow routes 11 between the individual pots and to the gates 4, 6, 8; they are installed up to the outside of a die. By this setup, a void to be produced when a resin flows can be discharged to the outside of the cavities and removed. By this setup, the void to be produced when the resin flows can be discharged efficiently to the outside of a flow route in the die a high-quality product can be obtained.
申请公布号 JPH01235340(A) 申请公布日期 1989.09.20
申请号 JP19880060551 申请日期 1988.03.16
申请人 HITACHI LTD 发明人 TSUNODA SHIGEHARU;SAEKI JUNICHI;KANEDA AIZO;YOSHIDA ISAMU
分类号 B29C45/02;B29C45/14;B29C45/36;B29L31/34;H01L21/00;H01L21/56 主分类号 B29C45/02
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