| 摘要 |
PURPOSE:To improve the adhesion of through-hole plating to the surface of a resin on the inner circumference of a through-hole by using a resin, with which fillers are mixed in loading within a specific range, as a resin for impregnation in a prepreg. CONSTITUTION:A plurality of metallic plates 2 in which through-holes 1 are formed at through-hole forming positions are superposed through prepregs 3, with which inorganic fillers are blended in loading of 30-150PHR as an impregnation resin. The superposed material is heated and pressure-molded, the resin infiltrated in the prepregs is cured, and each metallic plate is laminated and bonded while the resin infiltrated into the prepregs is made to flow and filled into respective through-hole in the metallic plates and cured. Through-holes 5 are boring-worked in the sections of the resins 4 in the through-holes, and the through-hole plating of copper, etc., is executed onto the inner circumferences of the through-holes and plating layers are shaped. Since the prepregs with which the fillers are compounded are used in said process, the fillers are exposed from the resin surfaces on the inner circumferences of the through-holes and the roughened surfaces of irregularities are formed, thus improving the adhesion of through-hole plating. |
