发明名称 CERAMIC CHIP TYPE ELECTRONIC PARTS
摘要 PURPOSE:To enable sealing indication, by forming a recessed part on the upper surface of ceramic, and spreading resin in the recessed part. CONSTITUTION:A green sheet having an internal electrode is formed by a well- known method. By using a metal mold provided with a suitable protrusion, the green sheets are alternately subjected to thermal contact bonding under the conditions of, e.g., 150-300kg/cm<2> and 70-150 deg.C, and a recessed part is formed. After cutting, the sheets are baked in an electric furnace. After baking, external electrodes are spread on both end-portions, and stoved. On the recessed part formed on the upper surface of ceramic 1, resin 2 like polybutadiene is spread with a dispenser and the like. The resin is hardened at a temperature of about 60-100 deg.C.
申请公布号 JPH01235222(A) 申请公布日期 1989.09.20
申请号 JP19880062542 申请日期 1988.03.15
申请人 NEC CORP 发明人 NISHIYAMA TOSHIHIKO;TSUKAWAKI KAZUYUKI
分类号 H01G4/12;H01G2/24 主分类号 H01G4/12
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