发明名称 SOLDER RESIST COMPOSITION
摘要 <p>PURPOSE:To obtain the title composition of one-pack type having storage stability, providing a coating film having excellent electrical insulating properties, containing a liquid epoxy resin, filler, dicyandiamide and a specific curing agent. CONSTITUTION:The aimed composition containing (A) a liquid epoxy resin (preferably one of glycidyl ether type of bisphenol A, having 160-250 epoxy equivalent), (B) a filler (e. g., calcium carbonate), (C) dicyandiamide and (D) a curing agent which is obtained by adding 0.8-2.5 equivalent epoxy group to 1 equivalent of amino group of a compound shown by the formula (R1 and R2 are 1-5C alkyl; X is 1-5C alkylene) to give an epoxyamine addition product and reacting the addition product with at least one of phenolic resin and polyhydric phenol.</p>
申请公布号 JPH01234471(A) 申请公布日期 1989.09.19
申请号 JP19880060237 申请日期 1988.03.16
申请人 TAMURA KAKEN KK 发明人 YANAGAWA MAKOTO;HASHIMOTO HIDEMI;HIRUMA KAZUO
分类号 C08G59/40;C09D11/03;C09D11/10;C09D11/103;C09D163/00;H05K3/28 主分类号 C08G59/40
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