| 摘要 |
<p>PURPOSE:To eliminate through-holes and reduce wiring areas and obtain a small size circuit substrate by a method wherein the respective conduction electrodes of circuit patterns are connected to each other with side electrodes formed on the side surface of the circuit substrate and the input-output electrodes of the respective circuit patterns are connected to the side electrodes. CONSTITUTION:First, second and third sheet substrates 2a, 2b and 2c are laminated to form a circuit substrate 1. At the conduction electrode 6a parts and input/ output electrode 6b parts, side electrodes 5a, 5b and 5c are provided. The respective conduction electrodes 6a of the substrates 2a and 2b are connected to each other with the electrodes 5a. The respective electrodes 6a and, further, the respective circuit patterns 3 of the substrates 2a, 2b and 2c are connected to each other with the electrodes 5b. The respective electrodes 5c are connected to the respective electrodes 6b of the substrates 2a, 2b and 2c to provide an input/output terminal. With this constitution, through-holes can be eliminated and wiring areas can be reduced, so that a small size circuit substrate can be obtained.</p> |
