| 摘要 |
<p>IMPROVED METHOD FOR REPLACING PCB-CONTAINING COOLANTS IN ELECTRICAL INDUCTION APPARATUS WITH SUBSTANTIALLY PCB-FREE DIELECTRIC COOLANTS Method of replacing a PCB-containing coolant in electrical induction apparatus having a vessel containing said PCB-containing coolant, an electrical winding and porous solid cellulosic electrical insulation immersed in, and impregnated with, said PCB-containing coolant with a substantially PCB-free high boiling dielectric permanent coolant into which any residual PCBs elute at no greater than a selected target rate. The method comprises steps of (a) removing a major portion Or the PCB-containing coolant from the vessel, (b) filling the vessel with an interim dielectric coolant substantially free of PCB which is (i) miscible with said PCB-containing coolant, (ii) sufficiently low in viscosity to circulate within the vessel and penetrate the interstices of the porous electrical insulation and (iii) capable of being readily separated from PCB, (c) electrically operating the apparatus to elute PCB contained in the coolant impregnated in the pores of the insulation therefrom into the interim coolant, (d) thereafter removing interim coolant containing eluted PCB, (e) repeating the cycle of steps (b), (c) and (d) if the PCB elution rate into the interim coolant after step (c) exceeds 5 times the selected target rate, a sufficient number of times until the PCB elution rate does not exceed 5 times said selected target rate, (f) filling the vessel with PCB-free high boiling dielectric silicone oil as coolant, (g) electrically operating the apparatus to elute interim coolant and additional PCB impregnated in the porous insulation therefrom into the silicone oil coolant, (h) thereafter removing the silicone oil coolant containing the eluted PCB from the vessel, (1) repeating the cycle of steps (r), (g) and (h), if the elution rate of PCB into the silicone oil exceeds the selected target rate, a sufficient number of times until the PCB elution rate into the silicone oil is less than the selected target rate, and refilling the vessel with a substantially PCB-free dielectric cooling liquid. S P E C I F I C A T I O N</p> |
