| 摘要 |
PURPOSE:To make it possible to increase the water resistance of a particle board and to improve productivity by using an aqueous phenol-modified melamine resin solution obtained by mixing an aqueous melamine resin solution and an aqueous phenol resin solution, each prepared by a specified process, together in a specified ratio as a resin component of an adhesive. CONSTITUTION:A component C obtained by mixing components A and B together is used as a resin component of an adhesive. Component A is an aqueous melamine resin solution of a nonvolatile matter content of 64-68wt.%, a pH of 8-9 and a water mixing rate of 5-10times, obtained by condensing 1mol of melamine with 2.0-2.8mol of formaldehyde in an alkaline condition; component B is an aqueous phenol resin solution of a nonvolatile matter content of 64-68wt.%, a pH of 8-9 and a water mixing rate of 10-20times, obtained by condensing 1mol of phenol with 2.0-2.5mol of formaldehyde in an alkaline condition; and component C is an aqueous phenol-modified melamine resin solution of a melamine component content of 30-35wt.%, a phenol component content of 5-10wt.% and a pH of 8-9, prepared by mixing component A with component B. |
