发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To prevent neck disconnection generated due to the transmission of the vibrations of ultrasonic waves by oppositely facing a projecting section provided to a heater block and a recessed section and bonding a wire, holding down a lead frame. CONSTITUTION:An inner lead section 13 in a lead frame is fast stuck to a heater block 11 while being held by a clamp 18 in which a recessed section 19 is shaped where opposite to the heat block 11 to which a projecting section 12 is formed. An electrode section 16 for a semiconductor element 15 and the inner lead section 13 are connected by a wire bonder by a wire 17. According to such constitution, the inner lead section 13 is held down positively even when parallelism on the assembly of the heater block 11 and the clamp 18 cannot be acquired and there is a twist on the press working of the inner lead section 13, thus allowing wire bonding having high reliability.
申请公布号 JPH01231334(A) 申请公布日期 1989.09.14
申请号 JP19880056003 申请日期 1988.03.11
申请人 OKI ELECTRIC IND CO LTD 发明人 KIDOKORO HAJIME
分类号 H01L21/60 主分类号 H01L21/60
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