| 摘要 |
PURPOSE:To make solderability of interconnection on the top layer better, and to make matching between a board and an electrode material as well better, by employing copper oxide as a conductor material, by employing a board material with a predetermined composition, and by performing de-binder through heat treatment in the air, reduction from the copper oxide to metal copper, and sintering of the board material and the metal copper. CONSTITUTION:Ceramic insulating layers 1a-1d are compositions each of which is so selected as to consist of 45-60wt.% Al2O3, 24-33wt.% SiO2, 2.4-3.3wt.% B2O3, 1.2-1.65wt.% Na2O, 0.8-1.1wt.% K2O, 3.2-4.4wt.% CaO, 1.2-1.65wt.% MgO, and 7.2-9.9wt.% PbO with the total amounts being 100wt.%. In each of the insulating layers, conductor metallized layers having copper as a main constituent are formed in the interior and the exterior, respectively. A diffusion layer of copper oxide is provided in the interface between the conductor metallized layer and the insulating layer. By using the board material having such a composition as an insulating material, a multilayered body is formed, and binder is then removed. Thereafter, CuO is reduced to Cu, and the multilayered body is then sintered. |
