| 摘要 |
PURPOSE:To reduce sedimentation of conductive powder so as to enhance adherence thereof by providing the title paste comprising high purity resin, a diluent having low viscosity and copper conductive powder having a silver coating layer on its surface as essential components. CONSTITUTION:High purity resin, a diluent having low viscosity and conductive powder having a silver coating layer on its surface are mixed. Namely, the high purity resin is dissolved in the diluent, and as required, both components are partially bonded to each other by the effect of thermal reaction. The copper conductive powder having the silver coating layer on its surface is added thereinto so as to be sufficiently mixed therewith, followed by a kneading process by means of, for example, a three-roll and a vacuum degassing process, thereby obtaining the conductive paste. This enables whole ion concentration to be reduced and corrosive disconnection not to be liable to be generated. Therefore, low specific gravity and little sedimentation of the conductive powder result in improvement in adherence and hydrolitic resistance. |
