| 摘要 |
<p>PURPOSE:To facilitate workability in resin sealing and to improve productivity and mechanical strength against bending stress, by providing obtuse angle shapes or R-shaped corner-cut shapes for the shapes of the surrounding corner parts of a resin sealing area of a semiconductor device. CONSTITUTION:A semiconductor device is composed of a semiconductor mounting substrate 1, a dam substrate 2a, leads 3, a semiconductor element 4, an electrode 5, a bonding agent 6, outer electrodes 7, thin metal wires 8, a substrate through hole and a sealing resin 10. The inner surrounding shape of the resin sealing in the dam substrate 2a for preventing the outflow of the sealing resin 10 is formed as follows: all-obtuse octagonal shapes, circular shapes, elliptical shapes or R-shaped corner-cut shapes.</p> |
