| 摘要 |
<p>PURPOSE:To mount a semiconductor device on a printed circuit board with a good space factor, by opening an opening part of a case in the vertical direction with respect to the surface of the metal substrate, and extending the tip part of a metal conductor for external leading to the upper part of the metal substrate. CONSTITUTION:An insulating film 2 is formed on one main surface of a metal substrate 1. A patterned metal conductor 41, a metal conductor 42 for external leading and a copper block 43 are fixed on the film 2. A semiconductor chip 44 is fixed on the block 43. Required electrical connections are provided with inner lead wires 45. Thus, a semiconductor circuit assembly structure 4 is constituted. An opening part 7 is provided in a case 3. The opening part 7 and the inside of the case 3 are separated with a partitioning wall 31. The conductor 42 extends to the opening part 7 from the inside of the case 3. An outer connecting terminal 5 is fixed vertically on the conductor 42 extending to the opening part 7. The opening part 7 including the fixing part is filled with a resin 8 and tightly sealed. In this way, the semiconductor device can be mounted on a printed board intactly with a good space factor without bending the terminal 5.</p> |
