| 摘要 |
PURPOSE:To improve cooling efficiency, and enable the reduction of noise when thermal exchange of cooling water is performed by other equipment, by directly mounting a wiring board on the wall surface of a flow channel of cooling liquid, and providing the inside of the flow channel with another flow channel. CONSTITUTION:An LSI 14 is mounted on a ceramic substrate 11 wherein insulation is formed of inorganic material like ceramic in which wiring layers are laminated. The substrate 11 is mounted on a frange 13. The surface opposite to the surface on which the LSI 14 is mounted is faced inside and mounted on a frame 12. The multilayer interconnection boards 1 on which modules are mounted in the above manner are inserted in the frame 2, a flow channel 3 is formed by them, and cooling liquid is made to flow in the channel. Further an internal flow channel 4 is formed inside the flow channel 3, and cooling water is made to flow in the channel 4. Thereby thermal loss of the cooling liquid is improved. |
