| 摘要 |
PURPOSE:To simplify and miniaturize the circuit constitution by sticking a semiconductor element on a lead frame and forming a passive circuit in the lead frame and constituting at least a part of a peripheral circuit by the passive circuit and sealing the semiconductor element and the lead frame with dielectric materials. CONSTITUTION:An FET chip 101 is fixed to an FET chip fixing position 152 of a lead frame 151, and bonding wires 113a, 113b, 114, and 115 are connected, and they are sealed with a dielectric material 102, thus constituting a package for microwave circuit. The dielectric material 102 has a permittivity higher than that of a 'Teflon(R)' substrate. Therefore, respective dimensions of projections 131a, 131b, 141a, and 141b used as a matching circuit, inter-digital coupling circuits 135 and 145, and high-impedance lines 122a and 122b are smaller than those of the matching circuit and a bias circuit constituted on the 'Teflon(R)' substrate. Consequently, the whole of the circuit is miniaturized. |
