发明名称 Laser scribing method
摘要 A laser scribing system and method is described. In the system, a film formed on a substrate is irradiated with laser beam which is focused on a limited portion of the film in order to remove the portion and produce a groove. Laser beam used for eliminating the portion of film formed on a substrate is deprived of its border portion in advance of the focusing. Sperical aberration is suppressed due to this elimination.
申请公布号 US4865686(A) 申请公布日期 1989.09.12
申请号 US19880188766 申请日期 1988.05.03
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 SINOHARA, HISATO
分类号 H01S3/10;B23K26/06;B23K26/073;B23K26/36;H01L21/20;H01L21/268;H01L39/24;H05K1/03;H05K3/02;H05K3/38 主分类号 H01S3/10
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