| 摘要 |
An improved semiconductor wafer positioning apparatus which can achieve preliminary positioning of a semiconductor wafer with accuracy. The apparatus includes a positioning stage for receiving a semiconductor wafer thereon. The positioning stage has a pair of groups of semicircular grooves formed on an upper face thereof and communicated with an air sucking and blowing ports. Thus, air is blown out from the upper face of the positioning stage so that the semiconductor wafer is rotated by a blow of air. Meanwhile, the positioning stage is inclined a small angle so that the semiconductor wafer is moved downward by its own weight on the positioning stage until a positioning element is contacted with an orientation flat of the wafer to stop rotation of the wafer, thereby positioning the wafer in position.
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