发明名称 Copper-free gold alloy composition
摘要 A gold colored, tarnish and corrosion resistant copper free allow is disclosed usable for jewelry, dental purposes and the like. The alloy consists essentially of 8 to 20 percent Gold, 22 to 26 percent Indium, 22 to 28 percent Palladium, and the balance is essentially Silver.
申请公布号 US4865809(A) 申请公布日期 1989.09.12
申请号 US19880251688 申请日期 1988.09.30
申请人 DAVITZ, DANIEL 发明人 DAVITZ, DANIEL
分类号 A44C27/00;A61K6/04;C22C30/00 主分类号 A44C27/00
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