| 摘要 |
PURPOSE:To contrive the improvement of the yield and the reliability of a semiconductor device having a J-shaped outer lead by a method wherein a package member is made thick in a degree that the bottom surface of the package member reaches the folding-back part of the outer lead. CONSTITUTION:A package member 2 is lowered to a degree that the bottom surface 2B of the member 2 comes into contact to the internal surface of a folding-back part 4C2 of a J-shaped outer lead 4C, but a gap is somewhat generated between the bottom surface 2B and the internal surface to make thick the thickness on the side of the bottom surface 2B of the member 2. Therefore, the lead 4C is provided extendedly along the side surface 2D and the bottom surface 2B of the member 2, the mechanical strength of the lead 4C is increased, the deformation of the lead 4C can be reduced and at the same time, the mechanical strength of the member 2 is increased and the generation of cracks in the member 2 can be reduced. Thereby, the improvement of the yield and the reliability of a semiconductor device are contrived. |
