| 摘要 |
PURPOSE:To prevent the short-circuit between adjacent connecting wires and to contrive an increase in the number of the connecting wires by a method wherein conductor ribbons are formed integrally with a semiconductor chip on the peripheral part of the chip, electrode pads are arranged on the insides of these conductor ribbons and the ribbons and bonding wires, which are each connected to the electrode pad, are respectively provided extendedly in a state that a vertical distance exists between the ribbons and the bonding wires. CONSTITUTION:Parts of a circuit of a semiconductor chip 1 are connected electrically to the side of a PGA substrate 11 by conductor ribbons 2 and the residual parts of the circuit are connected to the side of the substrate 11 by bonding wires 4. The ribbons 2 are provided extendedly on almost the same plane as the surface of the chip 1, the wires 4 are provided extendedly in the form of a loop at positions higher than the surface of the chip and the ribbons 2 and the wires 4 respectively make the chip 1 connect electrically with the substrate 11. Accordingly, a trouble that both interfere with each other and are short-circuited is scarcely generated. Thereby, even in case the number of wires to be used for an electrical connection with the substrate 11 is increased in response to an increase in the density of the chip 1, this way can easily deal with this and can correspond to an increase in the density and the multipin formation of a semiconductor device. |
