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发明名称
DIE BONDING OF SEMICONDUCTOR
摘要
申请公布号
JPH01227442(A)
申请公布日期
1989.09.11
申请号
JP19880054259
申请日期
1988.03.08
申请人
MATSUSHITA ELECTRON CORP
发明人
TAKAOKA KIYOSHI
分类号
H01L21/52;H01L21/66
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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