| 摘要 |
<p>PURPOSE:To hold a wafer positively, to prevent the positional displacement of the wafer and the damage of the wafer even when the speed of a wafer transfer arm is adjusted largely and the wafer is carried at high speed and to sustain the wafer surely even in a vacuum by providing the wafer transfer arm, a semiconductor board fixed to the transfer arm and two or more of mutually separate electrodes. CONSTITUTION:A wafer transfer tool has a wafer transfer arm 1A, a semiconductor board 2A fastened to the wafer transfer arm 1A and two or more of mutually separate electrodes 3A brought into contact with a surface of the wafer transfer arm 1A side of the semiconductor board 2A. An insulating board 5 is bonded with the top face of the nose of the wafer transfer arm 1A made of aluminum, and the SiC board 2A, on one side surface of which the electrode films 3A, 3A are formed through electrodes plating, etc., and which has resistivity of 10<8>-10<9>OMEGA.cm and 1mm thickness, is fixed onto the insulating board. Voltage is applied between the electrodes 3A, 3A from a voltage supply source, and a wafer 6 is attracted electrostatically and held as shown in the figure. Electrostatic attraction force by a Johnsen-Rahbeck effect is generated between the semiconductor board 2A and the wafer 6 at the time.</p> |
