| 摘要 |
<p>PURPOSE: To eliminate a weak point of a through contact part by making thermal expansion coefficients of a metal core and other conductive plate materials near as much as possible. CONSTITUTION: A metal core 1 can be provided with a synthetic resin layer 5 on its one surface or both surfaces, and a synthetic resin film 2 is required, in principle, as a substrate on which the synthetic resin layer 5 is provided. These materials are so selected that the metal core 1 shows high thermal conductivity, conformity is established among various materials used, and there is no large difference between thermal expansion coefficients of components in combination of the metal core 1 and the synthetic resin layer 5. Thereby, it is avoided that the thermal stress occurring in a single layer or between different layers, as a result of thermal expansion, causes undesirable action. Thus, a metal core conductive plate in which a through contact point has high reliability is obtained.</p> |
