SEMICONDUCTOR COMPONENT WITH TWO CONNECTIONS AND PROCESS AND DEVICE FOR MANUFACTURING IT

摘要

A semiconductor component has two leads (3) arranged on the same axis and a prefabricated plastic casing (1) filled with a plastics material. One bump passes through the base (1a) of the casing (1). A prefabricated semiconductor body (4) is fastened between the facing sides of the inner ends (60, 70) of the leads (3). These various elements are inserted in the casing (1) and bent inside the latter. The starting point of the manufacturing process is totally different from that of conventional processes for manufacturing leads in that the wire (30) unwound from a roll of wire (39) remains continuous throughout most of the production stages and is separated among the individual semiconductor elements only when the casings (1) have been mounted.