摘要 |
A solid state opto electrical sensor in a DIL packaged chip, is fitted to a chassis inside a camera. The sensor guide is and positioned in relation to the camera in which it is mounted. Guidance permits a displacement of at least 2 degrees. The sensor is fitted onto a baseplate which fits onto the chassis. The chassis has tapped holes around three of its edges through which adjustment screws are passed. Side pieces hold the chip in place and the screws are adjusted to position the side pieces and hence the chip. Two springs are mounted in cups on the fourth side of the chassis to aid adjustment. ADVANTAGE - Less susceptable to shock and smaller.
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