| 摘要 |
PURPOSE:To prevent any short-circuit failure from being produced among conductive circuits by filling a conductive circuit formation space formed opposite thermoplastic insulating films with a conductive paste material and bonding them. CONSTITUTION:An insulating film substrate 1 and an insulating film coating 2 are pressed and thermoformed in superposition by a thermoforming press having a upper mold 3 in which concave grooves 5 are engraved and a flat plate shaped lower mold 4. An opening 8 for injection of a conductive paste material A is formed in one end of a conductive circuit formation space 7. Once the paste material A is filled, a paste circuit 10 is solidified by a calcination treatment and bonded to a substrate 1 surface. A conductive paste circuit is completed by trimming. Hereby, the conductive paste circuits are prevented from being shortcircuited, thereby reducing the loadings of a paste material. |
