发明名称 PHOTORESIST MATERIAL
摘要 PURPOSE:To impart adequate adhesiveness to the photoresist material without impairing the preferable characteristics thereof by incorporating a photosensitive layer and the resin obtd. by bringing formaldehyde into reaction with an arom. hydrocarbon of specific average member of carbon atoms in the presence of an acidic catalyst into the material. CONSTITUTION:The resin obtd. by bringing the formaldehyde into reaction with the arom. hydrocarbon of 7-12C in the presence of the acidic catalyst is added to the photosensitive resin. Such arom. hydrocarbon formaldehyde resin is a liquid resin which is nonreactive and viscous, has good thermal stability and is well compatible with an epoxy resin, etc. Since this resin is well compatible with the epoxy resin, the resin imparts excellent flexibility to the photoresist and prevents cracking and crazing. The arom. hydrocarbon formaldehyde resin is highly resistant to alkalis and the photocured resin is hardly attacked by an alkaline etching soln. The tracking and crazing are thereby prevented and the adhesiveness is enhanced.
申请公布号 JPH01225939(A) 申请公布日期 1989.09.08
申请号 JP19880053020 申请日期 1988.03.07
申请人 GENERAL SEKIYU KAGAKU KOGYO KK 发明人 YOROZU SUSUMU
分类号 G03F7/004;G03F7/032;G03F7/085;H05K3/06 主分类号 G03F7/004
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